StarTech.com Metal Oxide Thermal CPU Paste Compound - 1.5g Re-sealable Syringe

StarTech Thermal Paste, 1.5g Metal Oxide Heat Sink Compound, Re-sealable Syringes, CPU Paste

This StarTech.com Metal Oxide Thermal CPU Paste Compound is engineered to enhance heat dissipation from CPUs and GPUs when used with a heat sink. Containing 60% metal oxide, it offers superior thermal conductivity compared to standard pastes, making it a reliable choice for maintaining optimal operating temperatures in desktop computers, workstations, and servers. The paste's composition ensures efficient heat transfer, helping prevent overheating and prolonging component lifespan. Its CE and RoHS certifications guarantee safety and compliance with environmental standards, making it suitable for professional and industrial applications.

Features:

• The IT Pro's Choice: Designed and built for IT professionals, this thermal paste is backed by a 2-year warranty along with free lifetime 24/5 multi-lingual technical support.

• Safety and Reliability: Certified by CE and RoHS, this compound contains 60% metal oxide, providing better thermal conductivity than standard heat transfer pastes. It is best suited for CPUs with TDP up to 65W.

• Resealable Design: Packaged in a 1.5g syringe, enough for 4 to 6 applications, with a resealable feature to prevent drying and spoilage between uses. Ideal for technicians and service professionals.

• Thermal Conductivity: Delivers consistent performance across temperatures from -22°F to 365°F (-30°C to 180°C). It provides a thermal conductivity of 3.195 W/m-K at 25°C, making it suitable for efficient heat management in various computing environments.

• Effective Heat Dissipation: The metal oxide-based compound works seamlessly with heat sinks to improve heat transfer from CPUs and GPUs, helping maintain stable operation and prevent thermal throttling.