StarTech.com Metal Oxide Thermal CPU Paste Compound - 1.5g Re-sealable Syringe for Efficient Heat Dissipation

StarTech Thermal Paste, 1.5g Metal Oxide Heat Sink Compound, Re-sealable Syringes, CPU Paste

The StarTech.com Metal Oxide Thermal CPU Paste Compound is designed for IT professionals and technicians seeking reliable thermal management solutions for desktop computers, workstations, and servers. This high-performance thermal grease enhances heat transfer from CPUs and GPUs to heat sinks, ensuring optimal operating temperatures and system stability. Its composition includes 60% metal oxide, providing superior thermal conductivity compared to standard pastes, making it ideal for CPUs with a thermal design power (TDP) of up to 65W. The paste's effective temperature range spans from -22°F to 365°F (-30°C to 180°C), allowing it to perform reliably under various operating conditions. Packaged in a 1.5g resealable syringe, it offers enough material for approximately 4 to 6 applications while preventing drying out between uses. The syringe's design facilitates clean, precise application, which is critical for maintaining system performance and preventing thermal issues. This product is CE and RoHS certified, reflecting its safety and environmental compliance, and is manufactured in Taiwan to strict quality standards. Backed by a two-year warranty and free lifetime technical support, the StarTech.com thermal paste provides a dependable solution for professional hardware servicing and maintenance needs. Whether you're upgrading a CPU or maintaining a server, this thermal compound ensures effective heat dissipation, helping to extend component lifespan and improve overall system efficiency.

Features:

• Designed for IT professionals with a 2-year warranty and free lifetime multilingual technical assistance

• CE and RoHS certified for safety and environmental compliance; contains 60% metal oxide for enhanced thermal conductivity

• Includes a 1.5g resealable syringe, sufficient for 4-6 applications; prevents drying and facilitates precise application

• Operates reliably within a temperature range of -22°F to 365°F (-30°C to 180°C); thermal conductivity of 3.195 W/m-K at 25°C or greater

• Metal oxide-based compound that improves heat dissipation from CPUs and GPUs when used with heat sinks, supporting efficient thermal management