StarTech.com SILVGREASE10-PRO High-Performance Silicone Thermal Paste for CPUs, GPUs, and ICs

StarTech High-Performance Silicone Thermal Paste, Compound for CPUs GPUs and ICs, Processor Grease Improves Heat Transfer and Cooling

Enhance the thermal management of your workstations, servers, and embedded systems with the StarTech.com SILVGREASE10-PRO thermal grease. This professional-grade silicone compound provides efficient heat transfer, ensuring your critical components operate within safe temperature ranges. Its high thermal conductivity of 14.5 W/m·K enables effective dissipation of heat from processors, graphics cards, and integrated circuits, helping to maintain system stability during sustained high workloads. The paste's wide operating temperature range from -58°F to +536°F (-50°C to +280°C) makes it suitable for demanding environments and high-performance applications. Its electrically non-conductive nature ensures safe application, preventing short circuits even if the paste contacts nearby sensitive components, which is essential in tightly packed or complex system designs. The product comes with a 10-gram resealable syringe featuring a screw cap and a plunger, allowing clean, controlled, and reusable application for upgrades, maintenance, or custom builds. This design simplifies the application process, reduces spills, and makes it easy to reuse in future projects, providing a reliable solution for IT professionals and system builders. Packaged with a plastic spreader and comprehensive documentation, the thermal grease supports efficient thermal management in a variety of computing environments. With a two-year limited warranty, the SILVGREASE10-PRO is a trusted choice for those seeking dependable heat transfer solutions that protect sensitive components and optimize system performance.

Features:

• Improve heat transfer with high-performance thermal paste: Professional-grade silicone-based compound delivers efficient heat transfer for processors, GPUs, and ICs; helps maintain stable temperatures in computers, servers, and mission-critical systems

• Manage high temps in space-constrained builds: High thermal conductivity of 14.5 W/m·K and a temperature range from -58°F to +536°F (-50°C to +280°C) improve heat control in compact PCs and embedded systems under sustained workloads

• Protect components with non-conductive thermal compound: Electrically insulating formula prevents shorts if the paste contacts nearby components, ensuring safe application and reliable operation while reducing maintenance downtime

• Simplified application: 10g syringe with screw cap prevents spills and allows for easy reuse; the included plunger enables clean, controlled application suitable for custom builds, upgrades, and component maintenance

• The IT professional's choice: Designed for demanding environments, providing a reliable thermal management solution that enhances system stability and longevity