Thermaltake TG-30 Thermal Compound – High Conductivity GPU & CPU Thermal Grease with Application Kit

The Thermaltake TG-30 Thermal Compound is designed to optimize heat transfer for your PC components, featuring a remarkable thermal conductivity of 4.5 W/m·K thanks to its advanced diamond powder formulation. This high-performance thermal paste ensures efficient heat dissipation, helping to maintain optimal operating temperatures for CPUs and GPUs under demanding workloads. The compound's formulation provides a long-lasting performance, resisting drying out or cracking over time, which contributes to better system stability and longevity. Its non-electrical conductive properties add an extra layer of safety, reducing the risk of short circuits during application. The included honeycomb stencil allows for precise, mess-free application, making it suitable for both novice and experienced users seeking a neat and consistent layer of thermal compound. The comprehensive application kit contains a scraper and alcohol pads, facilitating a thorough cleaning process and accurate coverage. With a compact weight of approximately 0.14 ounces, this thermal paste is lightweight and easy to handle, ensuring minimal hassle during installation. Manufactured by Thermaltake Technology Co., Ltd in China, the TG-30 comes with a two-year limited warranty, providing confidence in its quality and durability. Whether upgrading your existing system or building a new one, the Thermaltake TG-30 Thermal Compound offers a reliable solution for maintaining optimal thermal performance in your computer system.

Features:

• High thermal conductivity of 4.5 W/m·K with diamond powder formulation for efficient heat transfer

• Easy-to-use honeycomb stencil for neat and uniform application

• All-in-one application kit includes scraper, alcohol pads, and honeycomb stencil for convenience

• Long-lasting performance resistant to dry-out and cracking

• Non-electrical conductive compound ensures safe application and operation